BitHash About the Product
Complete BGA Reballing Kit for Whatsminer Control Board CPU Repair
Restore full functionality to your Whatsminer control boards with this precision-engineered H3 BGA Reballing Kit, specially designed for Allwinner H3 CPU chip maintenance. Ideal for reballing oxidized pins or installing new chips, this all-in-one repair solution ensures accurate solder ball placement and consistent results.
High-Precision BGA Rework Tool with Magnetic Base & Alignment Plate
This 3-in-1 kit includes:
Magnetic Base – Ensures stable and secure positioning during operation
Positioning Plate – Aligns the H3 chip perfectly for accurate tinning
Steel Mesh Stencil – High-temperature resistant for uniform solder ball application
Key Features & Benefits
✔ 90%+ Repair Success Rate – Engineered for maximum efficiency
✔ Durable Materials – Military-grade aluminum and tempered steel withstand high heat
✔ Quick Reballing – Complete process in under 15 minutes
✔ Multi-Purpose Use – Suitable for both chip replacement and oxidized pin repair
✔ Expert Handling Tips – Includes guidance for optimal stencil removal
Whatsminer H3 Allwinner CPU Reballing Kit Specifications
| Feature | Specification |
|---|---|
| Compatibility | Allwinner H3 CPU (Whatsminer Control Boards) |
| Includes | Magnetic Base, Positioning Plate, Steel Mesh Stencil |
| Material | Aircraft-grade aluminum base, tempered steel mesh |
| Max Temperature | Withstands continuous use up to 400°C |
| Solder Ball Size | 0.3mm (compatible with most BGA pastes) |
| Dimensions | 120mm × 80mm × 25mm (fully assembled) |