About the Product
Complete BGA Reballing Kit for Whatsminer Control Board CPU Repair
Restore full functionality to your Whatsminer control boards with this precision-engineered H3 BGA Reballing Kit, specially designed for Allwinner H3 CPU chip maintenance. Ideal for reballing oxidized pins or installing new chips, this all-in-one repair solution ensures accurate solder ball placement and consistent results.

High-Precision BGA Rework Tool with Magnetic Base & Alignment Plate
This 3-in-1 kit includes:

• Magnetic Base – Ensures stable and secure positioning during operation

• Positioning Plate – Aligns the H3 chip perfectly for accurate tinning

• Steel Mesh Stencil – High-temperature resistant for uniform solder ball application

Key Features & Benefits
✔ 90%+ Repair Success Rate – Engineered for maximum efficiency
✔ Durable Materials – Military-grade aluminum and tempered steel withstand high heat
✔ Quick Reballing – Complete process in under 15 minutes
✔ Multi-Purpose Use – Suitable for both chip replacement and oxidized pin repair
✔ Expert Handling Tips – Includes guidance for optimal stencil removal

Whatsminer H3 Allwinner CPU Reballing Kit Specifications